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HDI PCB

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HDI PCB

HDI: Printed circuit board with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (≤ 100 µm), smaller vias (≤ 150 µm), and capture pads (≤ 400 µm), and higher connection pad density (>20pads/cm2) than employed in conventional PCB technology.

Microvia: A blind hole with diameter ( ≤ 150 µm) having a pad diameter ( ≤ 350 µm) formed by either laser or mechanically drilling, wet/dry etching, photo imaging or conductive ink formation followed by a plating operation for product development.

HDI construction types

The object of HDI is to achieve higher wiring density than conventional boards, and a central feature of the technology is the microvia, blind vias defined by hole diameters smaller than150µm and normally drilled by laser. The microvia only extends between two, or at most tree layers, and is usually used in combination with buried vias and regular conventional through-hole vias. A prime example of HDI technology is the BGA package itself which is a printed circuit board with extremely small features.

While the fabrication of conventional PCBs are standardized and well known, HDI boards are constructed in a wide variety of ways. IPC’s sectional design standard for HDI (IPC-2226) details 6 general classes of construction from class I where microvias are formed in the surface of a conventional PCB, to type VI in which electrical interconnections and mechanical structure are formed simultaneously. One of the prevalent structures, type III, is shown in the illustration to the right.

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